EN
BGA Assembly Capabilities
As a PCBA manufacturer with over 20 years of professional experience , ZEON ELECTRONICS is committed to providing global customers with one-stop PCB/PCBA solutions.
☑ Supports miniature BGA/QFN/CSP components
☑ Gapless welding
☑ 20+ years of PCB/PCBA manufacturing experience
Description
BGA Assembly Services of ZEON ELECTRONICS
ZEON ELECTRONICS is committed to providing customers with one-stop PCB/PCBA solutions. We can offer high-quality, cost-effective PCB BGA assembly services, with a minimum BGA pin pitch of 0.2 mm to 0.3 mm. mm .
Our assembly services cover the following BGA types:
Plastic Ball Grid Array Package (PBGA)
Ceramic Ball Grid Array (CBGA) Package
Micro Ball Grid Array (Micro BGA)
Ultra-fine line ball grid array package (MBGA)
Stacked ball grid array packages (Stack BGAs)
Pinned BGA and Pinless BGA
Quality inspection :
AOI inspection; X-ray inspection; voltage testing; chip programming; ICT testing; functional testing
ZEON ELECTRONICS's BGA Assembly Advantages
ZEON ELECTRONICS offers comprehensive services, including component sourcing, advanced BGA assembly, and one-stop PCB/PCBA solutions. Our BGA assembly advantages are reflected in:
Excellent anti-interference capability
Lower inductance and capacitance
Enhanced heat dissipation performance
Lower failure rate
It can reduce the number of PCB wiring layers.
ZEON ELECTRONICS BGA Assembly Specifications
ZEON ELECTRONICS is committed to providing industry-leading BGA assembly capabilities:
High-density integrated circuit support: can assemble fine-pitch integrated circuits with a minimum pitch of 0.38 mm .
Minimum spacing requirements: The minimum distance from the pad to the trace is 0.2 mm , and the minimum distance between two BGAs is 0.2 mm .
Component types : Passive devices, minimum size 0201 (inch) ; chips with pitch as small as 0.38mm ; BGA (0.2mm pitch), FPGA, LGA, DFN, QFN packages, and X-ray inspected ; connectors and terminals .
FAQ
Q1. How do you ensure the quality of BGA solder joints?
ZEON: Firstly, we do the nano-coated laser stencil and later inspect SPI thoroughly. We also carry out nitrogen reflow soldering so as to reduce the oxygen content. And at the end, using X-ray inspection equipment, we check the void ratio inside the solder joints.
Q2. How does your BGA enhance signal transmission speed?
ZEON: Since BGA involves solder balls which physically connect the chip and the PCB, the signal path is thus kept as short as possible, and the signal delay is drastically lowered as a result.
Q3. How do you do safe BGA rework?
ZEON: Through our experienced rework station, it is possible to desolder and re-insert BGAs without causing harm to the board and other components.
Q4. What measures do you take to avoid stress cracking?
ZEON: We apply filler glue to the bottom of large BGAs post reflow soldering; also, if our engineers have customers' thermal solutions, they will perform joint evaluation of the thermal solution.
Q5. What is the consequence of not cleaning the BGA bottom very thoroughly?
ZEON: Yes, inevitably. Residue of the flux may result in a short circuit. With a water wash/semi-water wash and ultrasonic cleaning equipment, we can clean the surface.
