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Robot Assembly
As a PCBA manufacturer with over 20 years of professional experience , KING FIELD is committed to providing high-quality, highly reliable Robot Assembly solutions to customers worldwide.
☑ Solder paste type: leaded solder paste or lead-free solder paste
☑ Delivery time: Prototype samples: 24 hours to 7 days; Mass production: 10 days to 4 weeks (expedited service available)
☑ Sheet materials: FR-4, high Tg FR-4, aluminum substrate, flexible sheet, rigid-flexible composite sheet
Description
Sheet materials : FR-4, high Tg FR-4, aluminum substrate (for thermal management), flexible printed circuit board (FPC, suitable for moving parts), rigid-flexible composite board (suitable for hinge joints).
Product features: High-performance processor, real-time operating system, precise motion control, communication capabilities, power management.
Technical advantages: One-stop PCBA solution, PCBA prototyping, OEM/ODM.
Surface treatments: Electroless nickel-gold plating (ENIG, suitable for fine-pitch components), hot air leveling (HASL), gold fingers (for edge connectors), organic solder mask (OSP), electroless silver plating.
KING FIELD Robot Assembly Manufacturing Parameters
project |
parameter |
number of floors |
1-40+ floors |
Assembly type |
Through-hole mounting, surface mount, hybrid assembly (THT+SMT), advanced stack-up packaging |
Minimum component size |
Imperial units: 01005 or 0201; Metric units: 0402 or 0603 |
Board |
FR-4, high Tg FR-4, aluminum substrate, flexible board, rigid-flex board |
Surface treatment |
Electroless nickel-gold plating (ENIG, suitable for fine-pitch components), hot air leveling (HASL), gold fingers (for edge connectors), organic solder mask (OSP), electroless silver plating. |
solder paste type |
Lead-containing solder paste or lead-free solder paste |
Maximum component size |
2.0 inches × 2.0 inches × 0.4 inches |
Component package type |
Ball Grid Array (BGA), Quad Flat No-Leader (QFN), Quad Flat Package (QFP), Small Outline Integrated Circuit (SOIC), Small Outline Package (SOP), Shrink Small Outline Package (SSOP), Thin Shrink Small Outline Package (TSSOP), Plastic Leaded Chip Carrier (PLCC), Dual In-line Package (DIP), Dedicated Robot Module |
Minimum pad spacing |
QFP/QFN: 0.4 mm (16 mils); BGA: 0.5 mm (20 mils) |
Minimum line width |
0.10 mm |
Minimum line spacing |
0.10 mm |
Detection method |
Automated Optical Inspection (AOI), X-ray Inspection for BGA Inspection (AXI), 3D Solder Paste Inspection (SPI) |
Test methods |
In-Circuit Testing (ICT), Functional Testing (FCT), Flying Probe Testing, Motor Driver and Sensor Verification |
Delivery cycle |
Prototype samples: 24 hours to 7 days; Mass production: 10 days to 4 weeks (express service available) |
Features |
High-performance processor, real-time operating system, precise motion control, communication capabilities, power management |
Why did Robot Assembly choose KING FIELD?
Based on Robot Assembly 's technical expertise in the PCBA industry and customer needs, KING FIELD has developed a "customized + intelligent + integrated" robot assembly solution:
l Minimum order quantity description
At KING FIELD, based on over 20 years of experience in the PCBA industry, we have specifically optimized the flexible configuration of our robotic assembly lines to support diverse customer order needs.
Minimum order quantity:
We support robot assembly services with a minimum order of 5 pieces . This standard applies to:
R&D prototyping and verification stage
Small-batch trial production requirements
Special process validation projects
Sample delivery typically takes 5-7 business days; expedited processing is available.
- Customized adaptation
KING FIELD's professional engineers all have over 20 years of PCBA manufacturing experience and can continuously optimize robot assembly parameters to adapt to the characteristics of PCBA products in different industries.
- Real-time monitoring
KING FIELD has introduced an MES production management system to achieve real-time monitoring, data traceability, and intelligent optimization of the production process.
- Integrated services
We provide a full range of services, from robot selection and production line setup to programming, debugging, and post-maintenance, helping customers quickly achieve automated production and lower the technical barriers.
l Full-cycle service guarantee
From initial Design for Manufacturability (DFM) analysis to transparent communication of production progress, and then to rapid after-sales response (responding within 24 hours) after delivery, KING FIELD provides comprehensive support.
- Quality Assurance
At KING FIELD , our production line integrates advanced process steps such as SPI solder paste inspection, AOI optical inspection, and X-ray inspection, forming a closed-loop quality control throughout the entire process to ensure the superior quality of every PCBA.
FAQ
Q1: What types of component mounting do you support? What is the minimum package size?
KING FIELD : We support mainstream packages such as 01005, 0201, BGA (0.3mm pitch), QFN, LGA, and CSP; our mounting accuracy is ± 0.025mm , minimum pad pitch is 0.15mm , and we can stably mount BGAs with a ball diameter ≥0.2mm .
Q2: How to ensure accuracy and yield when mounting high-density boards (such as 0.3mm BGA)?
KING FIELD : We will use an intelligent vision alignment system to achieve a placement accuracy of ±0.025mm, and then use laser-cut stencils and nano-coating technology to ensure uniform solder paste printing. We will also set up real-time monitoring indicators to automatically correct for offset and material rejection issues.
Q3: Can you handle mixed assembly processes (SMT+THT)?
KING FIELD : Mixed assembly can certainly be handled: an automated production line for SMT followed by THT , then selective wave soldering (minimum solder joint spacing 1.2mm) , and manual soldering stations (ESD protection).
Q4 : How to avoid secondary reflow damage in the mixing process ?
KING FIELD : We use a method of first attaching high-temperature resistant components, and then combining it with local temperature control and selective soldering, which can effectively prevent displacement and cold solder defects caused by secondary reflow.
Q5 : How to control the void ratio of welds to meet automotive/medical requirements?
KING FIELD : Employs vacuum reflow soldering technology for layered venting, combined with a customized solder paste formula and a full-process X-Ray layered monitoring system to ensure that the BGA void rate is stably controlled within 10-15%.
