BGA Assembly

What is BGA assembly?

BGA assembly refers to assembling BGA chips onto a printed circuit board. BGA assembly is actually a special type of SMT assembly; it requires the hundreds of tiny solder balls on the chip to be perfectly soldered onto the corresponding pads on the PCB surface.

KING FIELD's BGA assembly manufacturing parameters

Ball diameter: Commonly used are 0.3mm, 0.4mm, and 0.5mm. 0.3mm is used for small-sized chips (such as mobile phone CPUs), and 0.5mm is used for large-sized chips (such as industrial FPGAs). The ball diameter tolerance is ±0.02mm. Too large or too small a ball diameter will cause deviation in the amount of solder paste.

Ball​‍​‌‍​‍‌​‍​‌‍​‍‌ pitch: Refers to the distance between centers of adjacent solder balls, typically 0.5mm, 0.8mm, and 1.0mm. Assembly becomes dramatically more challenging as ball pitch goes smaller (0.5mm ball pitch is often associated with high-precision placement equipment requirements).

Solder ball materials: generally, solder balls are categorized into leaded (melting point 183℃) and lead-free (melting point 217℃). The majority of consumer electronic products utilize lead-free solder balls which are in compliance with RoHS standards, however, military and medical applications employ leaded solder balls mainly because of their low melting point and wider process window.

Package sizes: Most commonly used package sizes are 10mm×10mm, 15mm×15mm, and 20mm×20mm with a maximum size of 50mm×50mm. Accordingly, it is the package size that determines the PCB pad layout and stencil size.

Number of solder balls: At KING FIELD, RF chip BGAs usually have around 64 solder balls, while high-end FPGAs may have 1000+ solder balls.

Why Choose Us: Your Perfect BGA Assembly Partner

Being a BGA assembly supplier with two decades of experience, KING FIELD has been setting its foot apart from other rivals in the industry.

• Quality: KING FIELD vows and assures each client that our products can comply with international standards like IPC, ISO, and UL upon customer requests. Besides that, we don't enforce any minimum order quantity, thus you can collaborate with us without any reservation.

• Delivery & delivery time: Our sample or small batch works can get to you in as little as 3-5 working days; medium & large batch works are generally finished in 7-14 working days based on order quantity.

Transport modes

Global Delivery: We frequently market to such high-standard regions as Europe, America, and Japan, while also offering a stable, reliable air/sea freight door-to-door service.

Post-Sales Warranty

KING FIELD is capable of providing 24-hour technical support as part of the service. We are always here and ready for a pre-sales consultation and promptly after-sales response and, generally speaking, close working with our customers is basically our ​‍​‌‍​‍‌​‍​‌‍​‍‌philosophy.

1. We also offer a rare "1-year warranty + lifetime technical consultation" service in the industry. If the product has a non-human-caused quality problem, it can be returned or exchanged free of charge and the relevant logistics costs will be borne by us.
2. Our after-sales team has an average response time of no more than 2 hours, ensuring that we can resolve your issues quickly and perfectly .

Q1. How do you ensure a high yield rate for BGA soldering?
KING FIELD: We use high-precision fully automated pick-and-place machines and temperature-controlled nitrogen reflow soldering equipment; then we further process each board... AOI and X-ray 100% full inspection.

Q2. What types of PCBs and BGA components do you support?

KING FIELD: We can manufacture PCBs ranging from single-sided to multi-layer boards , with a maximum size of 500mm * 500mm. Our BGA assembly supports both standard and micro BGAs, with a minimum pin pitch of 0.3mm and a minimum ball diameter of 0.15mm .

Q3. What are the common types of your BGA components?

KING FIELD: Our common types of BGA components include CBGA (Ceramic Ball Grid Array), PBGA (Plastic Ball Grid Array), and TBGA (Track Ball Grid Array).

Q4. What is your production capacity?
KING FIELD : We have 7 fully automated SMT production lines with a daily capacity of 60 million points , supporting large-volume orders from our customers.

Q5. What is the standard solder ball pitch for your BGA components?

KING FIELD: The standard solder ball pitch for our BGA components ranges from 0.5 mm to 1.0 mm, but can be as low as 0.3 mm.