EN
SMT Assembly Capabilities
KING FIELD is a PCBA manufacturer with over 20 years of professional experience. We are committed to providing global customers with one-stop PCB/PCBA solutions.
☑ 20+ years of PCB/PCBA manufacturing experience
☑ Our SMT daily production capacity can reach 60,000,000 chips/day
☑ We provide one-stop PCB + SMT turnkey solutions.
Description
KING FIELD has 7 brand new YAMAHA high-speed, high-precision placement machines.
Our MES system enables digital production and traceability throughout the entire production process.
Minimum mountable device size: 01005;
Placement speed: 300-600 solder joints/hour
Minimum BGA thickness: 0.3mm for rigid boards; 0.4mm for flexible boards;
Minimum precision lead size: 0.2mm
Component assembly accuracy: ±0.015mm
Maximum component height: 25mm
SMT capacity: 60,000,000 chips/day
Delivery time: 24 hours (express)
Order volume: Our SMT factory supports medium to high volume production.
Why choose KING FIELD?
Experience and production capacity
- With over 20 years of experience in the printed circuit board (PCB) industry, our 300+ engineers and production staff have accumulated extensive PCB assembly experience across multiple sectors including automotive, aerospace, medical, and consumer electronics.
- KING FIELD's production line is equipped with 7 SMT lines, 3 DIP lines, 2 assembly lines, and 1 painting line. Our YSM20R placement accuracy can reach ±0.015mm, and it can handle the smallest 0.1005 components. Our daily SMT capacity is 60 million points, and our daily DIP capacity is 1.5 million points.
KING FIELD 's SMT assembly capabilities
KING FIELD has built a complete manufacturing platform that integrates front-end R&D design, procurement of superior components, precision SMT placement, DIP insertion, complete machine assembly and full-function testing.
- Our production facilities can assemble the following SMT types of components:
Ball Grid Array (BGA) , Ultra-Fine Ball Grid Array (uBGA) , Quad Flat No-Leader Package (QFN) , Quad Flat Package (QFP) , Plastic Leaded Chip Carrier (PLCC) , and PoP (PoP)
- We also include a variety of value-added processes:
Supports SMT+THT mixed assembly, including selective wave soldering, and provides conformal coating services.
KING FIELD 's main SMT equipment
Automatic solder paste printer, reflow oven, high-speed pick and place machine, component dispenser , 3D solder paste inspection machine, AOI inspection , X-ray inspection machine
Our company has two finished product assembly lines, which can help customers assemble structural components and finished products.
FAQ
Q1 : What size components can you mount?
KING FIELD : Our placement equipment has an accuracy of ± 0.015mm and supports precision components such as 01005 and 0.3mm BGA .
Q2 : Can you balance rapid prototyping and stable mass production?
KING FIELD : We have a dedicated new product communication channel that can respond to your needs 24 hours a day . Only after the prototyping parameters are finalized will we upload them to the MES system for final mass production .
Q3 : Can we trace the problem if there is one?
KING FIELD : Yes. Our MES system is linked to the PCB barcode, allowing us to check material loading records, actual oven temperature profile records , and SPI/AOI inspection data.
Q4 : Have you done any special processes such as high frequency, heat dissipation, and underfill ?
KING FIELD : Yes, we have. We have experience in manufacturing special processes such as high frequency boards, aluminum substrates, and underfill . We can also ensure long-term reliability of special processes such as selective wave soldering, lamination, potting, and conformal coating .
Q5 : How do you manage valuable materials and humidity-sensitive components ?
KING FIELD : We have temperature and humidity controlled warehouses , as well as dedicated vacuum packaging and dehumidifier cabinets. Each material is labeled with its lifespan after being unpacked.
