Mixed Assembly Advantages
As a PCBA manufacturer with over 20 years of professional experience , KING FIELD is committed to providing global customers with one-stop PCB/PCBA solutions.
☑ Supports ODM/OEM
☑ 20+ years of PCBA manufacturing experience
☑ SMT+THT mixed packaging
Description
PCB types available to assembly include: rigid, flexible, rigid-flex, and aluminum boards.
PCB assembly specifications feature : Maximum size: 480x510mm; Minimum size: 50x100mm
Minimum thickness of BGA : 0.3 mm for rigid PCB ; 0.4 mm for flexible PCB .
Type Of soldering : Containing lead; Lead free (RoHS compliant); Water-based solder paste
Minimum assembly component : 01005
Minimum precision lead size: 0.2mm
Component placement accuracy: ±0.015mm
Maximum height of component: 25mm
Assembly turnaround: 8 to 72 hours once the parts are ready.
Order quantity: 5 to 100,000 units range; from prototyping to mass production
What is Mixed Assembly?
Mixed PCBs are made by joining two different PCB technologies i.e. surface mount technology (SMT) and through-hole technology (THT). In fact, most applications have both surface mount devices (SMD) and through-hole components.
Reasons to choose KING FIELD?
l The reasons why you choose KING FIELD's Mixed Assembly
- Top-notch reliability: Combining both SMT and THT technologies in Mixed Assembly brings out the best in each, resulting in outstanding quality and performance .
- Light-weight, highly resistant to stress and strongly precise
- With two mounting methods, the dual-use of components through Mixed Assembly technology, can be used for different types of components, and expands the range of options.
- Even more flexible: It can accommodate different design requirements and functional needs, and is perfect for a wide range of application scenarios such as industrial control, medical equipment, and automotive electronics.
- Greater production efficiency: Hybrid PCB production can be run on a fully automated basis, thus boosting efficiency, lowering costs, and speeding up PCB manufacturing and assembly.
l More than 20 years of experience in the industry
- Our 300+ engineers and production personnel have gained a wealth of PCB assembly experience in various sectors such as automotive, aerospace, medical, and consumer electronics, thanks to a 20+ year history of the printed circuit board (PCB) industry.
- Moreover, we have developed a service manufacturing platform that covers R&D design, procurement of excellent components, precision SMT placement, DIP insertion, entire assembly, and full-function testing. We will be delighted to offer customers with one-stop PCB/PCBA solutions.
l Production capacity
KING FIELD's production line is equipped with 7 SMT lines, 3 DIP lines, 2 assembly lines, and 1 painting line. Our YSM20R placement accuracy can reach ±0.015mm, and it can handle the smallest 0.1005 components. Our daily SMT capacity is 60 million points, and our daily DIP capacity is 1.5 million points .
Supports 100% X-ray inspection in installation and repair processes.
l Transportation support
KING FIELD 's exported mixed-assembly circuit board products, we mainly use three logistics methods:
International express (2-5 days) : Suitable for samples or high-value small items, anti-static packaging is required;
International air freight (5-10 days) : High cost-performance ratio for bulk finished products;
International sea freight (25-40 days) : Suitable for large, non-urgent orders, lowest cost but requires enhanced moisture-proof packaging.

FAQ
Q1 : How do you ensure that surface mount and through-hole components do not interfere with each other during reflow soldering of mixed-assembly boards?
KING FIELD : Our engineering team conducts DFM audits during the new product introduction phase. Our double-sided mixed assembly uses bottom red glue curing and top reflow soldering to prevent components from falling off during the second reflow process .
Q2 : How do you avoid bridging and solder bridging?
KING FIELD : We use selective wave soldering, and then use a nozzle for spot soldering to avoid already mounted fine-pitch components ; the soldering area is protected with nitrogen gas to reduce oxidation.
Q3 : How do you assign responsibility when the leads of through-hole components are oxidized or deformed ?
KING FIELD : All our incoming materials undergo full inspection by IQC. When a problem is found , we immediately take photos for record-keeping and then notify the customer for confirmation. If the problem is due to the quality of the incoming materials, we will immediately suspend their use and provide feedback to the customer for handling; if the problem is due to process damage , we will bear the costs of rework and replacement materials .
Q4 : How do you guarantee the quality of connectors, relays, etc. ?
KING FIELD : Our connectors, relays, and other components undergo full inspection before being put into storage , mainly checking their appearance, dimensions, and pins. Of course, we also provide original manufacturer certificates for our imported components .
Q5 : How do you ensure that components are not misplaced or mixed up ?
KING FIELD : Before loading materials, we scan the barcodes to verify them. Of course, we double-check the key materials. Our MES system can also trace the entire manufacturing process of each board .