SMT Assembly

SMT assembly manufacturing capabilities

With over 20 years of experience in the printed circuit board assembly industry, KING FIELD is a high-tech enterprise specializing in one-stop electronic design and manufacturing. We have built a complete manufacturing platform integrating front-end R&D design, procurement of superior components, precision SMT placement, DIP insertion, complete assembly, and full-function testing.

• Production capacity:

Seven integrated SMT automated production lines, with a monthly placement volume of up to 60 million points (Chip / QFP / BGA ± 0.035mm).

• Specification:

Supported PCB board sizes range from 50mm x 100mm to 480x510mm, and component sizes range from 0201 packages to 54 square millimeters (0.084 square inches). It can handle a variety of component types, including long connectors, 0201 packages, chip-scale packages, ball grid array packages (BGA), and square flat packages (QFP).

• Assembly type:

Assembly of single-sided, double-sided, rigid, flexible, and rigid-flexible combined printed circuit boards.

• equipment:

Solder paste printer, SPI (solder paste inspection) equipment, fully automatic solder paste printer, 10-zone reflow oven, AOI (automatic optical inspection) equipment, X-ray inspection equipment.

• Application industries : medical, aerospace, automotive , IoT, consumer electronics, etc.
• Surface mount technology equipment :

KING FIELD, a full-chain manufacturing enterprise with over 20 years of experience in circuit board assembly and manufacturing , We boast a professional team of over 300 people. Leveraging our one-stop solutions, high-end product structure, professional product development and manufacturing technology, stable quality performance, and comprehensive management system, we excel in rapid PCBA prototyping and full-service turnkey assembly. We are committed to becoming a benchmark in the ODM/OEM PCBA intelligent manufacturing industry, providing customers with reliable printed circuit board assembly services.

• Turnkey PCB Assembly

20+ years of PCB assembly experience , mature SMT assembly , providing end-to-end sourcing and testing.

• Quality control:

KING FIELD's quality control department has more than 50 professionals who strictly control key aspects such as incoming material inspection, process quality control, and finished product inspection.

• Strong engineering and project support:

KING FIELD also has 7 electronics engineers who support the development and provision of reference -based SMT solutions , and continuously provide constructive improvement suggestions on design-to-manufacturing and assembly (DFMA) manufacturability and engineering processes, effectively improving product quality and overall production efficiency.

• Real-time traceability:

KING FIELD's production lines are equipped with electronic information displays and a digital production and traceability (MES system) system to ensure that the production process is transparent and controllable.

• Packaging with anti-static bags or anti-static foam ensures the safety of the product during transportation.
• Certifications and Qualifications:

• ISO13485, ISO9001, IATF16949, ISO14001, ISO45001.

Based on its expertise in the PCBA field, KING FIELD has earned the trust of partners across various industries.

KING FIELD is equipped with a comprehensive after-sales support system.

KING FIELD also offers an industry-rare "1-year warranty + lifetime technical consultation" service. We promise that if a product has a non-human-caused quality problem, it can be returned or exchanged free of charge and the relevant logistics costs will be borne by us . KING FIELD is primarily dedicated to serving its customers and ensuring their purchasing experience.

Q1: How to solve the problems of insufficient solder paste printing, solder spikes, or bridging?

KING FIELD : We will use laser-cut and electropolished, stepped or nano-coated stencils to optimize stencil design and cleaning, depending on the component pin pitch. The scraper pressure and speed were calibrated to optimize demolding speed and clearance; and an SPI solder paste tester was introduced to achieve 100% online detection and real-time feedback.

Q2: How to prevent component misalignment or tombstoning during component placement?

KING FIED : We regularly calibrate our pick-and-place machines, precisely setting the placement height, vacuum, and placement pressure according to the component type and weight, and optimizing the pad and stencil opening design to ensure balanced solder paste release force at both ends.

Q3: How to avoid cold solder joints, incomplete solder joints, or voids after reflow soldering?

KING FIELD : For each product, we use an oven temperature tester to scientifically set the parameters for each stage of preheating, heating, reflow, and cooling. We also use nitrogen protection for reflow soldering to reduce oxidation, and regularly maintain the reflow oven to ensure process stability.

Q4: How to prevent components from cracking or being damaged after soldering?

KING FIELD : King Field implements MSD-level control for moisture-sensitive components, bakes them according to regulations before going online, adjusts the heating rate, and avoids thermal shock; for large BGA components, bottom support is used to reduce deformation.

Q5: How to ensure the long-term reliability of solder joints and prevent premature failure?

KING FIELD : Of course, we should optimize the process to ensure sufficient time above the peak temperature and liquidus line to form a good and moderate IMC layer. In environments with large vibrations and temperature variations, we should consider using high-reliability solder paste (such as adding dopants) and establish a verification system for aging tests, thermal cycling tests, vibration tests, etc., to expose potential failures in advance.