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Box Build Assembly
As a PCBA manufacturer with over 20 years of professional experience , KING FIELD is committed to providing global customers with high-quality, highly reliable Box Build Assembly solutions.
☑ 20+ years of experience in small to medium batch production
☑ MES system enables digital production and traceability
☑Minimum BGA thickness: 0.3mm for rigid boards; 0.4mm for flexible boards
Description
What does box-type assembly mean?
Box assembly refers to a system integration assembly service that allows for a thorough end-to-end flow starting from product concept designing to the housing assembly of the electronic components.
KING FIELD's box assembly strengths
MES System: Digitize Manufacturing, Production and Tracking
Assembly and Testing: Conduct total-function test and verification of the product and provide finished product packaging services.
Mounting Precision: Chip / QFP / BGA ± 0.035mm
Smallest assembly component: 01005
Smallest BGA: 0.3mm rigid board; 0.4mm for flexible boards;
Smallest lead size: 0.2mm
Component assembly precision: ±0.015mm
Maximum component height: 25mm
SMT output capability: 60,000,000 chips/day
Delivery time: 24 hours (express)
Order quantity: The SMT factory can handle medium to large-scale production.
Why should you pick KING FIELD as your Chinese container assembly manufacturer?
- Deep accumulation
Founded in 2017, KING FIELD's main staff has more than two decades working experience in the manufacturing of PCBA. Our philosophy is to offer our clients one-stop PCB/PCBA solutions.
- Self-owned factory
We have our own surface mount technology (SMT) factory with a floor area of more than 15,000 square meters, allowing us to produce in an integrated manner from SMT placement and THT insertion to full machine assembly. Our production enablement consists of 7 SMT lines, 3 DIP lines, 2 assembly lines, and 1 coating line. Our YSM20R pick-and-place machine places components with an accuracy of ±0.035mm and can handle 01005 size components. Our daily SMT capacity is 60 million points; our daily DIP capacity is 1.5 million points. Rush orders can be delivered within 24 hours, thus enabling us to react quickly to customers' bulk order requirements.
l Extensive testing and quality assurance
- KING FIELD has a flying probe tester, 7 automatic optical inspection (AOI) stations, X-ray inspection, functional testing, and other testing stands to fully control quality in the entire process.
- KING FIELD has been certified in six major systems: IATF 16949, ISO 13485, ISO 9001, ISO 14001, ISO 45001 - occupational health and safety management systems, and QC 080000 - environmental management, and hazardous substances. Using a digital MES system, we enforce complete traceability so that each PCBA is of uniform quality.
- After-sales service
We provide an industry-uncommon "1-year warranty plus lifetime technical consultation" service. Our after-sales team's average response time is less than 2 hours. Also, we guarantee that in case the product has a non-human-caused quality defect, we may offer free returns and exchanges and also bear the associated logistics costs.
FAQ
Q1 : How do you ensure that interlayer misalignment does not occur in multilayer boards during the box lamination process?
KING FIELD : To forecast and modify the situation, we employ pressure field simulation, then with the aid of a pressure sensor pad, real-time pressure distribution adjustment is realized. Each batch undergoes interlayer alignment testing too.
Q2 : How do you avoid the internal stress caused by box-type pressing that leads to board breakage later?
KING FIELD : We only apply a mild temperature and step-by-step increase in pressure. We also perform a 48-hour standing period for the board after pressing in order to slowly exhaust the internal stress of the board.
Q3 : How do you handle the glue flow control problem in box lamination?
KING FIELD : We calculate the most suitable amount of glue base on the board thickness, number of layers and area, after that a flow-blocking groove of about 0.3mm is designed on the edge of the board that allows to ensure the glue flow is just right.
Q4 : How do you ensure the quality of box lamination for thick copper plates?
KING FIELD : We put thermally conductive pads at the thick copper part, and rough the copper surface to make it grip better, then proceed to low-temperature pre-pressing at 30℃ to flatten the board.
Q5 : How do you control the uniformity of the dielectric layer in multilayer board box lamination?
KING FIELD : From the material selection stage, we strictly control the quality, according to the thickness of the dielectric layer to automatically adjust the lamination schedule, carrying out a thickness measurement at several points immediately after lamination, finally making a feedback to production of the next batch based on the data.
