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SMT Assembly Capabilities
KING FIELD is a PCBA manufacturer with over 20 years of professional experience . We are committed to providing global customers with one-stop PCB/PCBA solutions.
☑ 20+ years of PCB/PCBA manufacturing experience
☑ Our SMT daily production capacity can reach 60,000,000 chips/day
☑ We provide one-stop PCB + SMT turnkey solutions.
Description
KING FIELD has 7 brand new YAMAHA high-speed, high-precision placement machines.
Our MES system enables digital production and traceability throughout the entire production process.
Minimum mountable device size: 01005;
Placement speed: 300-600 solder joints/hour
Minimum BGA thickness: 0.3mm for rigid boards; 0.4mm for flexible boards;
Minimum precision lead size: 0.2mm
Component assembly accuracy: ±0.015mm
Maximum component height: 25mm
SMT capacity: 60,000,000 chips/day
Delivery time: 24 hours (express)
Order volume: Our SMT factory supports medium to high volume production.
Why choose KING FIELD?
l Experience and production capacity
- With over 20 years of experience in the printed circuit board (PCB) industry, our 300+ engineers and production staff have accumulated extensive PCB assembly experience across multiple sectors including automotive, aerospace, medical, and consumer electronics.
- KING FIELD's production line is equipped with 7 SMT lines, 3 DIP lines, 2 assembly lines, and 1 painting line. Our YSM20R placement accuracy can reach ±0.015mm, and it can handle the smallest 0.1005 components. Our daily SMT capacity is 60 million points, and our daily DIP capacity is 1.5 million points.
l KING FIELD 's SMT assembly capabilities
KING FIELD has built a complete manufacturing platform that integrates front-end R&D design, procurement of superior components, precision SMT placement, DIP insertion, complete machine assembly and full-function testing.
- Our production facilities can assemble the following SMT types of components:
Ball Grid Array (BGA) , Ultra-Fine Ball Grid Array (uBGA) , Quad Flat No-Leader Package (QFN) , Quad Flat Package (QFP) , Plastic Leaded Chip Carrier (PLCC) , and PoP (PoP)
- We also include a variety of value-added processes:
Supports SMT+THT mixed assembly, including selective wave soldering, and provides conformal coating services.
l KING FIELD 's main SMT equipment
Automatic solder paste printer, reflow oven, high-speed pick and place machine, component dispenser , 3D solder paste inspection machine, AOI inspection , X-ray inspection machine
Our company has two finished product assembly lines, which can help customers assemble structural components and finished products.
FAQ
Q1 : What size components can
you mount? KING FIELD : Our placement equipment has an accuracy of ± 0.015mm and supports precision components such as 01005 and 0.3mm BGA .
Q2 : Can you balance rapid prototyping and stable mass production?
KING FIELD : We have a dedicated new product communication channel that can respond to your needs 24 hours a day . Only after the prototyping parameters are finalized will we upload them to the MES system for final mass production .
Q3 : Can we trace the problem if there is one?
KING FIELD : Yes. Our MES system is linked to the PCB barcode, allowing us to check material loading records, actual oven temperature profile records , and SPI/AOI inspection data.
Q4 : Have you done any special processes such as high frequency, heat dissipation, and underfill ?
KING FIELD : Yes, we have. We have experience in manufacturing special processes such as high frequency boards, aluminum substrates, and underfill . We can also ensure long-term reliability of special processes such as selective wave soldering, lamination, potting, and conformal coating .
Q5 : How do you manage valuable materials and humidity-sensitive components ? KING
FIELD : We have temperature and humidity controlled warehouses , as well as dedicated vacuum packaging and dehumidifier cabinets. Each material is labeled with its lifespan after being unpacked.
