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PCB Surface Finish Types
KING FIELD's team has an average of 20+ years of PCB/PCBA manufacturing experience and is committed to providing customers with one-stop PCB/PCBA solutions.
☑ Supports blind vias and micro vias
☑ The MES system enables full traceability of the manufacturing process for each board.
☑ Supports ODM/OEM
Description
PCB Surface Finish types
Lead-free tin plating , electroplating gold plating , leaded tin plating , HASL plating, immersion tin plating, immersion silver plating, ENIG plating, ENEPIG plating, nickel-gold plating, OSP plating, ENIG + OSP plating, nickel-gold plating + ENIG plating, nickel-gold plating + HASL plating, ENIG + HASL plating, flash gold plating; hard gold plating.
Comparison of common processes in KING FIELD
Process |
Features |
Application |
Tin spraying |
Low cost, good weldability, mature technology, and good repairability |
Cost-sensitive consumer electronics with relatively large component pin spacing and low requirements |
OSP |
High surface smoothness, simple and environmentally friendly process, and low cost. |
Fine-pitch, high-density interconnects, low-cost consumer electronics |
Chemical nickel gold |
It has a very smooth surface, good wear resistance, good weldability, good surface conductivity, strong oxidation resistance, and a long shelf life. |
High-reliability products requiring smooth surfaces, contact points, buttons, multiple reflow soldering cycles, or long-term storage. |
Chemical tin plating |
Smooth surface, good weldability, environmentally friendly and lead-free. |
Fine-pitch connectors are used on boards with high flatness requirements. |
Chemical silver immersion |
It has a very smooth surface, excellent welding performance, a wide solderability window, is environmentally friendly and lead-free, and has a fast processing speed. |
Ultra-fine pitch, high-speed digital signals, consumer electronics, communication modules. |
Electroplating nickel gold |
It has excellent wear resistance, conductivity and contact reliability, strong oxidation resistance and long service life. |
Gold fingers , button contacts, test points, switch contacts, etc., that require frequent plugging and unplugging and highly reliable contact. |
Chemi-coated nickel-palladium-gold |
The palladium layer effectively prevents nickel corrosion and "black disk" problems; an extremely thin gold layer provides good protection; the soldering reliability is extremely high; and it is resistant to multiple reflow soldering cycles. |
Highest reliability requirements necessitate gold wire bonding for applications such as aerospace,medical,and high-frequency/high-speed boards. |
Why choose KING FIELD as the PCB finish types ?
- Manufacturing process
Assembly types: SMT assembly (including AOI inspection); BGA assembly (including X-ray inspection); through-hole assembly; mixed SMT and through-hole assembly; kit assembly.
Specialized processes: multilayer/HDI, impedance control, high Tg, thick copper, blind/buried vias/microvias, countersunk holes, selective plating, etc.; providing one-stop SMT /PCBA services .
Quality Inspection: AOI inspection; X-ray inspection; voltage testing; chip programming; ICT testing; functional testing
- 20+ years of rich experience
Since its establishment in 2017, KING FIELD has accumulated rich experience in PCB manufacturing. Currently, we have a research and development team of 50+ people and a production team of 300+ people. Our team members have an average of 20+ years of industry experience in providing one-stop PCB/PCBA solutions .
- Scale and production capacity
- We own our own surface mount technology (SMT) factory, with a total area of over 15,000 square meters, which can realize integrated production of the entire process from SMT placement and THT insertion to complete machine assembly.
- KING FIELD's production line is also equipped with 7 SMT lines, 3 DIP lines, 2 assembly lines, and 1 painting line. Our YSM20R has a placement accuracy of ±0.015mm and can handle components as small as 0.1005.
- The daily production capacity of SMT can reach 60 million points; the daily production capacity of DIP can reach 1.5 million points.
FAQ
Q1 : How do you prevent solder joints from becoming brittle during chemical immersion gold ?
KING FIELD : We strictly control the phosphorus content of the nickel layer and the thickness of the gold layer ; then we conduct pull-out force tests and nitric acid vapor tests on each batch of boards .
Q2 : What is the storage period of your OSP ?
KING FIELD : Our OSP vacuum- packed products have a shelf life of 6-12 months and should be used within 24 hours of opening.
Q3 : Will the unevenness of the board surface after lead-free tin plating affect the soldering of fine-pitch components ?
KING FIELD : At KING FIELD, we abandon solder spraying for fine-pitch components and instead use immersion gold or OSP. If solder spraying is necessary , we use horizontal solder spraying to control the flatness of the pad surface .
Q4 : Will your immersion silver treatment turn black?
KING FIELD : We use an anti-sulfurization silver plating process, which forms a nanoscale organic protective film on the surface of the silver layer to isolate sulfides.
Q5 : Can you perform different surface treatments on the same board ?
KING FIELD : Compatible . We will use a selective surface treatment process, employing dry film masking for protection, first applying immersion gold and then OSP.
